TSV Liquid Cooling System for 3D Integrated Circuits
نویسندگان
چکیده
منابع مشابه
Data bus swizzling in TSV-based three-dimensional integrated circuits
The purpose of this paper is to efficiently exploit swizzling in reducing coupling noise between the bit lines of a TSV-based data bus in three-dimensional integrated circuits. The core concept of swizzling is to distribute the noise of an aggressor to all victims, rather than concentrating on the nearest victim. Based on this principle, an optimal swizzling pattern, which achieves an equal dis...
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It's not surprisingly when entering this site to get the book. One of the popular books now is the designing tsvs for 3d integrated circuits. You may be confused because you can't find the book in the book store around your city. Commonly, the popular book will be sold quickly. And when you have found the store to buy the book, it will be so hurt when you run out of it. This is why, searching f...
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Three-dimensional integrated circuits (3D ICs) introduce wafer bonding and Through Silicon Vias (TSVs) as new modules, thus extending manufacturing requirements beyond CMOS. A 3D IC with a photosensor is taken as an example to further analyze the resulting new metrology requirements for mass production. For the wafer bond module, data on defects before and after bonding, bond interface adhesion...
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ژورنال
عنوان ژورنال: Journal of the Microelectronics and Packaging Society
سال: 2013
ISSN: 1226-9360
DOI: 10.6117/kmeps.2013.20.3.001